Flexible PCB(設計) - メーカー・企業と製品の一覧

High Current Compatible Flexible Circuit Board BigElec

The Big Elec flexible circuit board compatible with high current has three features.

Big Elec is a flexible circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-section. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high-current electronic components. Big Elec's low inductance reduces voltage spikes, contributing to the reliability of high-current electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible circuit boards. 【Feature 3】 High Design Freedom It ensures the same design freedom and usability as printed circuit boards. Pattern wiring and external shapes can be customized to meet specific requirements. It also supports the mounting of electronic components and connectors using paste solder.

企業：山下マテリアル
価格：100,000 yen-500,000 yen

Other electronic parts

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High Current Compatible Flexible Circuit Board BigElec

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.

企業：山下マテリアル
価格：500,000 yen-1 million yen

Harness

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Narrow pitch pad on beer flexible substrate

By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.

By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.

企業：山下マテリアル
価格：100,000 yen-500,000 yen

High frequency/microwave parts

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Low-rebound, high-speed transmission flexible substrate

Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.

The low-rebound, high-speed transmission FPC adopts a stripline structure and is an excellent flexible substrate for noise countermeasures using shielding materials. Compared to conventional 3-layer FPCs, it is approximately 200μm thinner and reduces rebound force to about one-third, while keeping transmission loss at the same level or lower. This innovative FPC, developed for communication devices, is expected to improve assembly workability and be used in movable parts. 【Four Features】 1. Reduces transmission loss to the same level or lower compared to conventional 3-layer FPCs and decreases rebound force to about one-third. 2. Improves assembly workability and allows for use in movable parts. 3. Enhances noise countermeasures through the adoption of stripline structure and shielding materials. 4. Supports compact device design due to its thin profile. For more details, please refer to the PDF materials or feel free to contact us.

企業：山下マテリアル
価格：100,000 yen-500,000 yen

Wiring materials

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Flexible PCB(設計) - メーカー・企業と製品の一覧

Flexible PCBの製品一覧

High Current Compatible Flexible Circuit Board BigElec

High Current Compatible Flexible Circuit Board BigElec

Narrow pitch pad on beer flexible substrate

Low-rebound, high-speed transmission flexible substrate

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